CUTTING APPARATUS

A cutting apparatus includes: a processing feeding unit that performs processing feeding of a chuck table adapted to hold a workpiece; and two cutting units in which rotational axes of two spindles coincide with each other and cutting blades mounted to the spindles face each other. Each cutting unit...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	NITTA, Shuji
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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