CUTTING APPARATUS

A cutting apparatus includes: a processing feeding unit that performs processing feeding of a chuck table adapted to hold a workpiece; and two cutting units in which rotational axes of two spindles coincide with each other and cutting blades mounted to the spindles face each other. Each cutting unit...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	NITTA, Shuji
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A cutting apparatus includes: a processing feeding unit that performs processing feeding of a chuck table adapted to hold a workpiece; and two cutting units in which rotational axes of two spindles coincide with each other and cutting blades mounted to the spindles face each other. Each cutting unit includes a flange mechanism in which the cutting blade having a cutting edge fixed to an outer peripheral edge of a one-side outer surface of a circular disk-shaped base is fixed to the spindle. The flange mechanism is fixed to a tip of the spindle, sucks an other-side outer surface of the base of the cutting blade, and fixes the cutting blade to the spindle with the one-side outer surface of the base exposed to the side of the tip of the spindle, and the one-side outer surfaces of the cutting blades fixed to the two cutting units.