MOLDED INTERCONNECT DEVICE AND METHOD OF MAKING SAME

In some embodiments, a manufacturing process includes injection molding a palladium-catalyzed material into a substrate, forming a thin copper film over exterior and exposed surfaces of the substrate; ablating or removing copper film from the substrate to provide first, second and optional third por...

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Bibliographische Detailangaben
Hauptverfasser:	KO, Hyun-Jong, KANG, SukMin, ZEILINGER, Steven, RILEY, Patrick, CHANG, Tsuey Choo
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	In some embodiments, a manufacturing process includes injection molding a palladium-catalyzed material into a substrate, forming a thin copper film over exterior and exposed surfaces of the substrate; ablating or removing copper film from the substrate to provide first, second and optional third portions of the copper film and ablated sections; electrolytically plating each portion to form metallic-plated portions; and ablating or removing the second portion in order to isolate the first portion. The metallic-plated first portion comprises a circuit portion of a molded interconnect device (MID), and where the metallic-plated third portion comprises a Faraday cage portion of a MID. A soft etching step may be included. A solder resist application step can be added, along with an associated solder resist removal step.