SEMICONDUCTOR DEVICES INCLUDING STACKED SEMICONDUCTOR CHIPS

A semiconductor device includes a chip stack structure including a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first semiconductor chip includes a first substrate, a first circuit layer on a front surface of the first substrate, and a first c...

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Bibliographische Detailangaben
Hauptverfasser:	Kwon, DooWon, Kim, Donghyun
Format:	Patent
Sprache:	eng
Schlagworte:	ARRANGEMENT OR MOUNTING OF PLURAL DIVERSE PRIME-MOVERS INVEHICLES ARRANGEMENT OR MOUNTING OF PROPULSION UNITS OR OFTRANSMISSIONS IN VEHICLES ARRANGEMENTS IN CONNECTION WITH COOLING, AIR INTAKE, GASEXHAUST OR FUEL SUPPLY OF PROPULSION UNITS, IN VEHICLES ARRANGEMENTS OR ADAPTATIONS OF HEATING, COOLING, VENTILATING,OR OTHER AIR-TREATING DEVICES SPECIALLY FOR PASSENGER OR GOODSSPACES OF VEHICLES AUXILIARY DRIVES FOR VEHICLES BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSTRUMENTATION OR DASHBOARDS FOR VEHICLES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING VEHICLES IN GENERAL
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Beschreibung
Zusammenfassung:	A semiconductor device includes a chip stack structure including a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip. The first semiconductor chip includes a first substrate, a first circuit layer on a front surface of the first substrate, and a first connecting layer disposed on the first circuit layer and including a first metal pad electrically connected to the first circuit layer. The second semiconductor chip includes a second substrate, a second circuit layer on a front surface of the second substrate, and a second connecting layer disposed on the second circuit layer and including a second metal pad electrically connected to the second circuit layer. The first connecting layer faces the second connecting layer. The first and second metal pads are in contact with each other to couple the first and second semiconductor chips to each other.