ELEMENT PLACE ON LAMINATES

A module includes a laminate, the laminate including a solder mask layer and at least one depression in an upper surface of the solder mask layer that does not pass all of the way through the solder mask layer. The module also includes a first electronic element disposed in a first of the at least o...

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Bibliographische Detailangaben
Hauptverfasser: Arvin, Charles L, Quinlan, Brian W, Erwin, Brian M
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A module includes a laminate, the laminate including a solder mask layer and at least one depression in an upper surface of the solder mask layer that does not pass all of the way through the solder mask layer. The module also includes a first electronic element disposed in a first of the at least one depressions.