SUBSTRATE PROCESSING APPARATUS

A substrate processing apparatus according to an embodiment includes a substrate processing tank, a processing liquid supply nozzle, and a pressure regulating plate. The processing liquid supply nozzle is provided in a lower portion within the substrate processing tank, and ejects the processing liq...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Ikeda, Takashi, Tanaka, Koji, Masutomi, Hiroyuki
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A substrate processing apparatus according to an embodiment includes a substrate processing tank, a processing liquid supply nozzle, and a pressure regulating plate. The processing liquid supply nozzle is provided in a lower portion within the substrate processing tank, and ejects the processing liquid from a plurality of ejection ports. The pressure regulating plate is provided between the processing liquid supply nozzle and the substrate in the substrate processing tank and has a plurality of holes through which the processing liquid flows. The pressure regulating plate is configured to adjust the inflow pressure of the processing liquid ejected from the processing liquid supply nozzle. In addition, the pressure regulating plate includes ribs that protrude from a processing liquid supply nozzle side surface thereof so as to partition the processing liquid supply nozzle side surface into a plurality of partitioned regions.