OPTOELECTRONIC COMPONENT

In one variant of the invention it is provided that an electro-optical component (30) is monolithically integrated in one or a plurality of semiconductor layers of the chip (110) arranged on the substrate top side (12a) of the substrate (12), or on the substrate top side (12a) of the substrate (12) and at least one electrical connection of the monolithically integrated electro-optical component (30) is connected by means of a connection line (41) to a conductor track connection (43) situated below the substrate rear side (12b), wherein the connection line (41) extends through a through hole (42) in the substrate (12) from the electro-optical component (30) to the conductor track connection (43) situated below the substrate rear side (12b).