Aluminum Based Solderable Contact

A method of producing a solderable aluminum contact comprises formulating an ink, applying the ink to an aluminum substrate to form an ink layer on a surface of the aluminum substrate, and melting the ink layer. The ink includes a solderable element that is conductive. The melting of the ink layer f...

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Bibliographische Detailangaben
Hauptverfasser: Wu, Yiliang, Sachs, Soenke, Soneja, Shallu, Gulsoy, Gokce, Greiner, Felix, Zhou, Xiao, Schmidt, Helge
Format: Patent
Sprache:eng
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Zusammenfassung:A method of producing a solderable aluminum contact comprises formulating an ink, applying the ink to an aluminum substrate to form an ink layer on a surface of the aluminum substrate, and melting the ink layer. The ink includes a solderable element that is conductive. The melting of the ink layer forms an alloy on the surface of the aluminum substrate including the solderable element.