ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

An electronic package and a method for fabricating the same are provided. The method includes disposing an antenna substrate on a package structure through a plurality of conductive elements. The antenna substrate has an antenna layer and the package structure has an electronic component. As such, a...

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Bibliographische Detailangaben
Hauptverfasser:	Chen, Kuan-Ta, Fang, Bo-Siang, Lu, Ying-Wei
Format:	Patent
Sprache:	eng
Schlagworte:	ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	An electronic package and a method for fabricating the same are provided. The method includes disposing an antenna substrate on a package structure through a plurality of conductive elements. The antenna substrate has an antenna layer and the package structure has an electronic component. As such, an antenna length can be designed according to the requirement of antenna operation, without increasing the area of the package structure.