SEMICONDUCTOR PACKAGE INCLUDING ORGANIC INTERPOSER

SEMICONDUCTOR PACKAGE INCLUDING ORGANIC INTERPOSER

A semiconductor package including an organic interposer includes: first and second semiconductor chips each having active surfaces having connection pads disposed thereon; the organic interposer disposed on the active surfaces of the first and second semiconductor chips and including a wiring layer...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: MYUNG, Jun Woo, KIM, Eun Sil, KIM, Yeong A, KUROYANAGI, Akihisa
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor package including an organic interposer includes: first and second semiconductor chips each having active surfaces having connection pads disposed thereon; the organic interposer disposed on the active surfaces of the first and second semiconductor chips and including a wiring layer electrically connected to the connection pads; barrier layers disposed onside surfaces of the first and second semiconductor chips; and an encapsulant encapsulating at least portions of the first and second semiconductor chips.