PLATING ANALYSIS METHOD, PLATING ANALYSIS SYSTEM, AND COMPUTER READABLE STORAGE MEDIUM FOR PLATING ANALYSIS

A method for analyzing plating comprising steps for: performing electrochemical measurement in an electroplating apparatus; deriving electrochemical parameters from result of the electrochemical measurement; specifying plating conditions which are applied when performing a plating process; based on...

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Bibliographische Detailangaben
Hauptverfasser:	SHAMOTO, Mitsuhiro, SHIMOYAMA, Masashi
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING METALLURGY PHYSICS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TESTING
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Beschreibung
Zusammenfassung:	A method for analyzing plating comprising steps for: performing electrochemical measurement in an electroplating apparatus; deriving electrochemical parameters from result of the electrochemical measurement; specifying plating conditions which are applied when performing a plating process; based on the electrochemical parameters and the plating conditions, determining current density distribution on a surface of a substrate which is an object of the plating process, wherein the current density distribution is represented by a predetermined function formula which comprises a variable which represents a position on the substrate; and based on the current density distribution, calculating thickness of a film plated on the substrate.