METHOD FOR PRODUCING HOT-DIP ALUMINUM-COATED STEEL WIRE

A production method for molten-aluminum-plated copper wire, the production method being characterized by use of a heating device (6) that is for heating a copper wire (2) before the copper wire (2) is immersed in a molten aluminum plating bath (1) and of a bath surface control device (7) that compri...

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Bibliographische Detailangaben
Hauptverfasser:	KAMOSHIDA, Shinichi, HATTORI, Yasunori, MIONO, Tadaaki
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A production method for molten-aluminum-plated copper wire, the production method being characterized by use of a heating device (6) that is for heating a copper wire (2) before the copper wire (2) is immersed in a molten aluminum plating bath (1) and of a bath surface control device (7) that comprises a tube-shaped body (9), which has a through hole (9a) for passing the copper wire (2) through the inside thereof, and includes an immersion region (9b) that is for immersion in the molten aluminum plating bath (1) from an end part of one end of the tube-shaped body (9) along the long direction of the tube-shaped body (9). The production method is also characterized in that the copper wire (2) is passed, in order, through the heating device (6) and the bath surface control device (7) and immersed in the molten aluminum plating bath (1) while the immersion region (9b) of the bath surface control device (7) is immersed in the molten aluminum plating bath (1).