POLYAMIDE MOULDING COMPOSITION AND MOULDED ARTICLE MADE THEREFROM

The present invention refers to a polyamide moulding composition consisting of the following components: (A) 30 to 79.7% by weight of at least one partially crystalline polyamide consisting of at least one diamine and at least one aromatic dicarboxylic acid, whereupon the at least one diamine has 4...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TAKAMASA, Fujii, LAMBERTS, Nikolai, HATTA, Minoru, ENDO, Makoto
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The present invention refers to a polyamide moulding composition consisting of the following components: (A) 30 to 79.7% by weight of at least one partially crystalline polyamide consisting of at least one diamine and at least one aromatic dicarboxylic acid, whereupon the at least one diamine has 4 to 20 carbon atoms and is selected from a group of diamines consisting of linear aliphatic diamines, branched aliphatic diamines, cycloaliphatic diamines and araliphatic diamines, (B) 0 to 10% by weight of at least one polyamide different from component (A) (C) 20 to 55% by weight of at least one fibrous reinforcing agent, (D) 0.2 to 2.0% by weight of nigrosine, (E) 0.1 to 3.0% by weight of at least one heat stabilizer, (F) 0 to 10% by weight of a at least one additive, whereby the entirety of components (A) to (F) add up to 100% by weight.