PHOSPHONATE BASED HALOGEN-FREE COMPOSITIONS FOR PRINTED CIRCUIT BOARD APPLICATIONS

Disclosed is a resin composition containing phosphonate and polyphenylene oxide (PPO) oligomers/polymers useful for coating prepregs used to make copper clad laminates used in printed circuit boards. The compositions contain crosslinking agents used to ensure a dense crosslink network as demonstrate...

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Bibliographische Detailangaben
Hauptverfasser:	LENS, Jan-Pleun, KAGUMBA, Lawino
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	Disclosed is a resin composition containing phosphonate and polyphenylene oxide (PPO) oligomers/polymers useful for coating prepregs used to make copper clad laminates used in printed circuit boards. The compositions contain crosslinking agents used to ensure a dense crosslink network as demonstrated by high glass transition temperatures (Tg's).