METHOD AND DEVICE FOR SEVERING A MICROCHIP FROM A WAFER AND ARRANGING THE MICROCHIP ON A SUBSTRATE

Method and device for severing a microchip from a wafer and arranging the microchip on a substrate, wherein the microchip is contact-bonded to the free end of a tip during severing and accordingly adheres to the tip through adhesive force while the substrate is transported. A coordinate measuring ma...

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1. Verfasser: PANITZ, Meik
Format: Patent
Sprache:eng
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Zusammenfassung:Method and device for severing a microchip from a wafer and arranging the microchip on a substrate, wherein the microchip is contact-bonded to the free end of a tip during severing and accordingly adheres to the tip through adhesive force while the substrate is transported. A coordinate measuring machine can advantageously be used as device.