THROUGH-HOLE FORMING METHOD, THROUGH-HOLE FORMING APPARATUS, AND METHOD OF MANUFACTURING GLASS SUBSTRATE PROVIDED WITH THROUGH-HOLE

Disclosed is a through-hole forming method including a process of forming, by condensing and irradiating a laser beam onto an insulation substrate through a lens, a through-hole that passes through the insulation substrate in a thickness direction of the insulation substrate. A medium between the le...

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Bibliographische Detailangaben
1. Verfasser:	ONO, Motoshi
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING CUTTING-OUT HAND CUTTING TOOLS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORATING PERFORMING OPERATIONS PUNCHING SEVERING SEVERING BY MEANS OTHER THAN CUTTING SOLDERING OR UNSOLDERING STAMPING-OUT TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	Disclosed is a through-hole forming method including a process of forming, by condensing and irradiating a laser beam onto an insulation substrate through a lens, a through-hole that passes through the insulation substrate in a thickness direction of the insulation substrate. A medium between the lens and the insulation substrate is air. A converging half angle that is calculated from a focal length f of the lens and a beam diameter d of the laser beam that enters the lens by using expression (1) satisfies expression (2): (d/2)/f=tan . . . (1), and 0.16 sin 0.22 . . . (2).