SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME

A semiconductor package device comprises an electronic component, a conductive bump and a first conductive layer. The electronic component has a top surface. The conductive bump is disposed on the top surface of the electronic component. The conductive bump includes a main body and a protruding port...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: FANG, Jen-Kuang, LU, Wen-Long
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor package device comprises an electronic component, a conductive bump and a first conductive layer. The electronic component has a top surface. The conductive bump is disposed on the top surface of the electronic component. The conductive bump includes a main body and a protruding portion. The first conductive layer covers a portion of the protruding portion. The first conductive layer has a first upper surface and a second upper surface. The first upper surface and the second upper surface are not coplanar.