AIRTIGHT PACKAGE AND METHOD FOR MANUFACTURING SAME

AIRTIGHT PACKAGE AND METHOD FOR MANUFACTURING SAME

Provided are an airtight package that can increase the bonding strength between the sealing material layer and the container and a method for manufacturing the same. An airtight package 1 includes: a container 2 with a frame 3; a glass lid 4 disposed on top of the frame 3 and sealing the container 2...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: YABUUCHI, Koichi, OKA, Takuji, SHIRAGAMI, Toru
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Provided are an airtight package that can increase the bonding strength between the sealing material layer and the container and a method for manufacturing the same. An airtight package 1 includes: a container 2 with a frame 3; a glass lid 4 disposed on top of the frame 3 and sealing the container 2; and a sealing material layer 5 disposed between the frame 3 and the glass lid 4 and bonding the glass lid 4 and the container 2 together, wherein in the sealing material layer 5 a bonding surface 5b between the sealing material layer 5 and the container 2 is larger than a bonding surface 5a between the sealing material layer 5 and the glass lid 4.