LASER PROCESSING METHOD

According to one embodiment, a laser processing method includes irradiating a region of a substrate with first laser light having a first pulse width greater than ten nanoseconds and irradiating the region substrate with second laser light having a second pulse width less than the first pulse width....

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	MATSUO, Mie
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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