LASER PROCESSING METHOD

According to one embodiment, a laser processing method includes irradiating a region of a substrate with first laser light having a first pulse width greater than ten nanoseconds and irradiating the region substrate with second laser light having a second pulse width less than the first pulse width....

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Bibliographische Detailangaben
1. Verfasser:	MATSUO, Mie
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	According to one embodiment, a laser processing method includes irradiating a region of a substrate with first laser light having a first pulse width greater than ten nanoseconds and irradiating the region substrate with second laser light having a second pulse width less than the first pulse width. In some embodiments, the region may be irradiated with the first and second laser lights simultaneously. In other embodiments, the irradiation with first laser light may occur before the irradiation with the second laser light.