METHOD FOR CUTTING ADHESIVE FILM, ADHESIVE FILM, AND WOUND BODY

In the formula (1), x is a glass transition point (° C.) of the adhesive film, and y is a tack value per unit length (N/cm) under room temperature of the adhesive film.

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Bibliographische Detailangaben
Hauptverfasser:	HORIKAWA, Kazuhide, SATO, Yoko
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY CONVEYING CUTTING DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING,CUTTING-OUT, STAMPING-OUT OR SEVERING DYES HAND CUTTING TOOLS HANDLING THIN OR FILAMENTARY MATERIAL HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PACKING PAINTS PERFORMING OPERATIONS POLISHES SEVERING STORING TRANSPORTING USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	In the formula (1), x is a glass transition point (° C.) of the adhesive film, and y is a tack value per unit length (N/cm) under room temperature of the adhesive film.