LASER CUTTING APPARATUS AND LASER CUTTING METHOD

A laser cutting apparatus includes a laser beam irradiation apparatus configured to radiate a laser beam, a pressure wave irradiation part including a plurality of pressure wave sources configured to radiate pressure waves toward a fusing part or a section to be cut by the laser beam, and a jet inje...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: KOMATSU, Yoshinao
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!