LASER CUTTING APPARATUS AND LASER CUTTING METHOD

LASER CUTTING APPARATUS AND LASER CUTTING METHOD

A laser cutting apparatus includes a laser beam irradiation apparatus configured to radiate a laser beam, a pressure wave irradiation part including a plurality of pressure wave sources configured to radiate pressure waves toward a fusing part or a section to be cut by the laser beam, and a jet inje...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: KOMATSU, Yoshinao
Format: Patent
Sprache:eng
Schlagworte:
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:A laser cutting apparatus includes a laser beam irradiation apparatus configured to radiate a laser beam, a pressure wave irradiation part including a plurality of pressure wave sources configured to radiate pressure waves toward a fusing part or a section to be cut by the laser beam, and a jet injection part configured to inject jets toward the fusing part or the section to be cut along respective outer circumferential sides of the pressure waves.