SUBSTRATE SUPPORT WITH ELECTRICALLY FLOATING POWER SUPPLY

Embodiments described herein generally relate to plasma assisted or plasma enhanced processing chambers. More specifically, embodiments herein relate to electrostatic chucking (ESC) substrate supports configured to provide pulsed DC voltage, and methods of applying a pulsed DC voltage, to a substrat...

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Bibliographische Detailangaben
Hauptverfasser:	DISTASO, Daniel, ROWLAND, Christopher A, MARKOVSKY, Mark, CASANOVA, Robert, KRAUS, Philip Allan, PARKHE, Vijay D, WANG, Haitao, KOH, Travis Lee
Format:	Patent
Sprache:	eng
Schlagworte:	CONVERSION OR DISTRIBUTION OF ELECTRIC POWER ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION PLASMA TECHNIQUE PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS
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Beschreibung
Zusammenfassung:	Embodiments described herein generally relate to plasma assisted or plasma enhanced processing chambers. More specifically, embodiments herein relate to electrostatic chucking (ESC) substrate supports configured to provide pulsed DC voltage, and methods of applying a pulsed DC voltage, to a substrate during plasma assisted or plasma enhanced semiconductor manufacturing processes.