METHOD OF ASSESSING SEMICONDUCTOR SUBSTRATE AND METHOD OF ASSESSING DEVICE CHIP

A method of assessing a semiconductor substrate includes a sticking step of sticking a device layer of the semiconductor substrate to a support substrate, a thinning step of thinning the semiconductor substrate from a reverse side thereof to a thickness smaller than a finished thickness after the st...

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Bibliographische Detailangaben
Hauptverfasser:	Kim, Youngsuk, Kodama, Shoichi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	A method of assessing a semiconductor substrate includes a sticking step of sticking a device layer of the semiconductor substrate to a support substrate, a thinning step of thinning the semiconductor substrate from a reverse side thereof to a thickness smaller than a finished thickness after the sticking step is carried out, and an assessing step of applying light to the semiconductor substrate from the reverse side thereof and measuring scattered light from the semiconductor substrate thereby to assess a property of the semiconductor substrate.