LEAD-FREE SOLDER ALLOY, ELECTRONIC CIRCUIT SUBSTRATE, AND ELECTRONIC DEVICE

A lead-free solder alloy includes 1% by weight or more and 4% by weight or less of Ag, 1% by weight or less of Cu, 3% by weight or more and 5% by weight or less of Sb, 0.01% by weight or more and 0.25% by weight or less of Ni, and Sn.

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Bibliographische Detailangaben
Hauptverfasser:	KATSUYAMA, Tsukasa, MUNEKAWA, Yurika, ARAI, Masaya, HORI, Atsushi, NAKANO, Takeshi
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A lead-free solder alloy includes 1% by weight or more and 4% by weight or less of Ag, 1% by weight or less of Cu, 3% by weight or more and 5% by weight or less of Sb, 0.01% by weight or more and 0.25% by weight or less of Ni, and Sn.