SEMICONDUCTOR PACKAGES

Semiconductor packages are provided. A semiconductor package includes a package base substrate that includes a base layer. A plurality of connection terminals are on the base layer. Moreover, a plurality of electromagnetic shielding terminals are on the base layer around the plurality of connection...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Jeon, Byeong-uk, Lee, Jong-joo, Kang, Hee-won
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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