SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGES

Semiconductor packages are provided. A semiconductor package includes a package base substrate that includes a base layer. A plurality of connection terminals are on the base layer. Moreover, a plurality of electromagnetic shielding terminals are on the base layer around the plurality of connection...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Jeon, Byeong-uk, Lee, Jong-joo, Kang, Hee-won
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Semiconductor packages are provided. A semiconductor package includes a package base substrate that includes a base layer. A plurality of connection terminals are on the base layer. Moreover, a plurality of electromagnetic shielding terminals are on the base layer around the plurality of connection terminals. The semiconductor package includes a package body that includes at least one semiconductor chip. The semiconductor package includes an electromagnetic shielding layer on the package base substrate and on the package body.