SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

In one embodiment, a semiconductor manufacturing apparatus includes first and second tanks configured to store a gas fed from a gas feeder. The apparatus further includes a chamber configured to process a wafer by using the gas fed from the gas feeder, the first tank or the second tank. The apparatu...

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Bibliographische Detailangaben
1. Verfasser:	Fukumaki, Naomi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MEASURING MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUIDLEVEL METALLURGY METERING BY VOLUME PHYSICS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TESTING
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Beschreibung
Zusammenfassung:	In one embodiment, a semiconductor manufacturing apparatus includes first and second tanks configured to store a gas fed from a gas feeder. The apparatus further includes a chamber configured to process a wafer by using the gas fed from the gas feeder, the first tank or the second tank. The apparatus further includes a controller configured to control feeding of the gas to the first tank, the second tank and the chamber.