MULTILAYER STRUCTURE FOR HOSTING ELECTRONICS AND RELATED METHOD OF MANUFACTURE

A method for manufacturing a multilayer structure, includes obtaining a first substrate film for accommodating electronics, said first substrate film having a first side and an opposite second side, said first substrate film including electrically substantially insulating material, said first substr...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Keranen, Antti, Heikkinen, Mikko, Haag, Ronald
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A method for manufacturing a multilayer structure, includes obtaining a first substrate film for accommodating electronics, said first substrate film having a first side and an opposite second side, said first substrate film including electrically substantially insulating material, said first substrate film preferably being formable and/or thermoplastic, providing, optionally by mounting and/or by printed electronics technology, circuitry on at least said second side of the first substrate film, said circuitry being functionally connected to the first side of the first substrate film, and molding, optionally by injection molding or reactive molding, plastic material on the first side of the first substrate film so as to at least partially cover it.