POWER MODULE FOR SUPPORTING HIGH CURRENT DENSITIES

A power module is disclosed that includes a housing with an interior chamber wherein multiple switch modules are mounted within the interior chamber. The switch modules comprise multiple transistors and diodes that are interconnected to facilitate switching power to a load. In one embodiment, at lea...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Zhang, Qingchun, Ryu, Sei-Hyung, Palmour, John Williams, Henning, Jason Patrick, Allen, Scott, Agarwal, Anant Kumar
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A power module is disclosed that includes a housing with an interior chamber wherein multiple switch modules are mounted within the interior chamber. The switch modules comprise multiple transistors and diodes that are interconnected to facilitate switching power to a load. In one embodiment, at least one of the switch modules supports a current density of at least 10 amperes per cm2.