HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MICROELECTRONIC PACKAGES

HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MICROELECTRONIC PACKAGES

A microelectronic package may be fabricated to include a microelectronic substrate, at least one microelectronic device attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one microelectronic device and having at least one projection attached to the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Raravikar, Nachiket R, Jain, Syadwad, Dhavaleswarapu, Hemanth K, Beatty, John J, Thanu, Dinesh P. R
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A microelectronic package may be fabricated to include a microelectronic substrate, at least one microelectronic device attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one microelectronic device and having at least one projection attached to the microelectronic substrate, and at least one standoff extending from the at least one projection, wherein the at least one standoff contacts the microelectronic substrate to control the bond line thickness between the heat dissipation device and at least one microelectronic device and/or to control the bond line thickness of a sealant which may be used to attached the at least one projection to the microelectronic substrate.