THIN MULTI-CHANNEL HEAT EXCHANGER

Technologies are disclosed herein for a thin heat exchanger through which coolant may be pumped. The heat exchanger may include an envelope and a heat conduction layer provided over the envelope. The envelope may include one or more channels formed therein. The channels formed between the envelope a...

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1. Verfasser: Brisebois, Art
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Technologies are disclosed herein for a thin heat exchanger through which coolant may be pumped. The heat exchanger may include an envelope and a heat conduction layer provided over the envelope. The envelope may include one or more channels formed therein. The channels formed between the envelope and the conduction layer may extend the length of the heat exchange layer and be configured to carry coolant therethrough. The heat exchange layer may include an inlet manifold on a first end and an outlet manifold on another end opposing the first end. The inlet manifold may allow the flow of coolant into the heat exchange layer and the outlet manifold may allow the removal of the coolant from the heat exchange layer. Coolant flow may be controlled by a suction pump operating under computer control based at least in part on sensor data.