REINFORCED POLYAMIDE MOLDING COMPOUNDS HAVING LOW HAZE AND MOLDED BODIES THEREFROM

The present invention relates to a polyamide molding compound comprising the following components or consisting of these components: (A) 50 to 95 wt % of a mixture comprising the specific polyamides (A1) and (A2); (B) 5 to 50 wt % of at least one glass filler having a refractive index in the range f...

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Bibliographische Detailangaben
Hauptverfasser: AEPLI, Etienne, HOFFMANN, Botho, HOFF, Heinz
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present invention relates to a polyamide molding compound comprising the following components or consisting of these components: (A) 50 to 95 wt % of a mixture comprising the specific polyamides (A1) and (A2); (B) 5 to 50 wt % of at least one glass filler having a refractive index in the range from 1.510 to 1.539; (C) 0 to 10 wt % of at least one additive; wherein the weight proportions of the components (A) to (C) add up to 100% by weight; wherein the content of (A1) in the mixture (A) is >50 wt %, if the ratio is Δ2/Δ1>1 and the content of (A2) in the mixture (A) is >50 wt %, if the ratio is Δ2/Δ1≤1, where Δ1=n(A1)−n(B) applies and Δ2=n(B)−n(A2) applies; wherein the transparent polyamides (A1) and (A2) have a transparency of at least 90% and a haze of at most 3%; and wherein the mixture (A) has a transparency of at least 88% and a haze of at most 5%. The present invention furthermore relates to molded bodies composed of these polyamide molding compounds.