SEMICONDUCTOR DEVICE

A semiconductor device includes a first insulating film on a semiconductor substrate; a fuse on the first insulating film, including first second terminal pads, a blowing strip having a width smaller than the first and second terminal pads, extending from the first terminal pad to the second termina...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: KATAKURA, Hideaki
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A semiconductor device includes a first insulating film on a semiconductor substrate; a fuse on the first insulating film, including first second terminal pads, a blowing strip having a width smaller than the first and second terminal pads, extending from the first terminal pad to the second terminal pad, a first connecting portion connecting the first terminal pad and the blowing strip, and a second connecting portion connecting the second terminal pad and the blowing strip, and a second insulating film covering the first insulating film and the fuse. The first and second connecting portions are asymmetric with respect to a reference plane passing through the middle point of the blowing strip, orthogonal to the extending direction of the blowing strip and normal to the principal surface of the semiconductor substrate.