PROCESSING APPARATUS

A processing apparatus includes a chuck table configured to hold a plate-shaped workpiece thereon, a processing unit including a spindle having an end portion at which a processing tool for grinding or polishing a workpiece held on the chuck table is to be mounted, a processing room surrounded by a wall and configured to accommodate the chuck table and the end portion of the spindle therein, and a dirty situation indication unit configured to indicate a degree of adhesion of processing waste, which is generated by grinding or polishing of the workpiece, to the wall. The dirty situation indication unit includes a transmission window made of a member that passes visible rays therethrough and configuring part of the wall, and a color sample indication unit indicative of a relationship between an amount of the processing waste adhering on the transmission window and a color of the transmission window.