FLEXIBLE CIRCUIT INTERCONNECT STRUCTURE AND METHOD OF MAKING SAME

Techniques and mechanisms for providing flexible packaged circuit structures. In an embodiment, a flexible circuit device includes first and second conductive contacts and an interconnect that is coupled between such conductive contacts. While the flexible circuit device is in a baseline ("flat") configuration, a first side of the flexible circuit device extends at least in part in a flat plane, and a portion of the interconnect includes a point that, with respect to a distance from the flat plane, is a maximum or a minimum of the interconnect. A mold compound of a flexible package encapsulates the portion of the interconnect. In another embodiment, a range spanned by the interconnect along a line orthogonal to the flat plane is at least two times an average height of the interconnect.