COVER ASSEMBLY FOR AN ELECTRONIC DEVICE, METHOD OF MANUFACTURE, AND DEVICE COMPRISING THE COVER ASSEMBLY

A cover assembly for an electronic device includes a glass layer having a first surface and a second surface opposite the first surface, a first having a first surface and a second surface opposite the first surface, and an optically clear polymer film disposed on the optically clear adhesive on a s...

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Bibliographische Detailangaben
Hauptverfasser: Allessio, Timothy Michael, Laurin, Michael M, Zhao, Wei, Sun, Xiaoyu, Choi, Jong-Min
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:A cover assembly for an electronic device includes a glass layer having a first surface and a second surface opposite the first surface, a first having a first surface and a second surface opposite the first surface, and an optically clear polymer film disposed on the optically clear adhesive on a side opposite the glass layer, the polymer film comprising a thermoplastic polymer. The cover assembly transmits greater than 85% of visible light as determined according to ASTM D1003-00. A method of manufacturing the cover assembly is also described. The cover assembly can be useful for use with an electronic device.