PRINTED CIRCUIT BOARD FABRICATION PROCESSES AND ARCHITECTURE INCLUDING POINT-OF-USE DESIGN AND FABRICATION CAPACITY EMPLOYING ADDITIVE MANUFACTURING

PRINTED CIRCUIT BOARD FABRICATION PROCESSES AND ARCHITECTURE INCLUDING POINT-OF-USE DESIGN AND FABRICATION CAPACITY EMPLOYING ADDITIVE MANUFACTURING

Apparatus and methods are provided which enable a capacity to remotely enable research, development, and production tasks to be done at a point of use (POU) as well as permitting some design tasks to be done remotely with manufacturing employing, for example, additive manufacturing (AM), for printed...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: Vetter, Stephen J
Format: Patent
Sprache:eng
Schlagworte:
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:Apparatus and methods are provided which enable a capacity to remotely enable research, development, and production tasks to be done at a point of use (POU) as well as permitting some design tasks to be done remotely with manufacturing employing, for example, additive manufacturing (AM), for printed circuit boards (PCB) as well as other electrical items. In particular, some embodiments are directed towards facilitating POU on-site manufacturing capacity with a remote or distributed requirements/design process.