FOLDABLE ELECTRONIC DEVICE ASSEMBLIES AND COVER ELEMENTS FOR THE SAME

FOLDABLE ELECTRONIC DEVICE ASSEMBLIES AND COVER ELEMENTS FOR THE SAME

A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress σI of at least about 100 MPa in compression at the first p...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Smith, III, Robert Lee, Gross, Timothy Michael, Mattos, JR., Louis, Chu, Polly Wanda, Donovan, Michael Patrick, Panda, Prakash Chandra
Format: Patent
Sprache:eng
Schlagworte:
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
TRANSPORTING
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Beschreibung
Zusammenfassung:A cover element for a foldable electronic device that includes a foldable glass element, first and second primary surfaces, and a compressive stress region extending from the first primary surface to a first depth that is defined by a stress σI of at least about 100 MPa in compression at the first primary surface. The device also includes a polymeric layer disposed over the first primary surface. The glass element has a stress profile such that when the glass element is bent to a target bend radius of from 1 mm to 20 mm, to induce a bending stress σB at the first primary surface in tension, σI+σB