MODULAR HYBRID CIRCUIT PACKAGING

An electronics package includes a platform and a board mounted to the platform, the board having electronics mounted thereon. A feedthrough pin passes through and is hermetically sealed to a feedthrough body and is wire bonded to the board. A cover is bonded to and surrounds the exterior surface of...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Walters, III, James, Cutter, David, Strei, David Matthew, Andrew, David Alexander
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	An electronics package includes a platform and a board mounted to the platform, the board having electronics mounted thereon. A feedthrough pin passes through and is hermetically sealed to a feedthrough body and is wire bonded to the board. A cover is bonded to and surrounds the exterior surface of the feedthrough body to produce a hermetically sealed chamber that houses the platform and the board.