DUAL STAGE STRUCTURAL BONDING ADHESIVE

Provided are methods and associated compositions directed to a structural bonding adhesive. The structural bonding adhesive is made by mixing a curable composition comprising a mixture of a first curable resin and a second curable resin to provide an uncured adhesive. The uncured adhesive is irradia...

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Bibliographische Detailangaben
Hauptverfasser:	Shafer, Kathleen S, Nelson, James M, Gao, Xiao, Schmid, Matthew J, Anderson, Cyrus A
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Provided are methods and associated compositions directed to a structural bonding adhesive. The structural bonding adhesive is made by mixing a curable composition comprising a mixture of a first curable resin and a second curable resin to provide an uncured adhesive. The uncured adhesive is irradiated by a first actinic light source to polymerize the first curable resin without polymerizing the second curable resin to provide a partially cured adhesive. The partially cured adhesive is a pressure-sensitive adhesive that displays cold flow creep recovery under ambient conditions and is capable of being fully cured by irradiating the partially cured adhesive using a second actinic light source that is different from the first actinic light source to polymerize the second curable resin.