COATING METHOD, COATING APPARATUS AND RECORDING MEDIUM

A coating sequence includes supplying a resist liquid onto a wafer under a condition that a liquid puddle of the resist liquid is formed at a central portion thereof; supplying, while rotating the wafer at a first rotation speed where the liquid puddle stays at an inner side than an edge of the wafe...

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Bibliographische Detailangaben
1. Verfasser:	Takahashi, Teppei
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PERFORMING OPERATIONS PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL SEMICONDUCTOR DEVICES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
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Beschreibung
Zusammenfassung:	A coating sequence includes supplying a resist liquid onto a wafer under a condition that a liquid puddle of the resist liquid is formed at a central portion thereof; supplying, while rotating the wafer at a first rotation speed where the liquid puddle stays at an inner side than an edge of the wafer, a diluting liquid and moving a supply position of the diluting liquid from an outside of the liquid puddle to an edge portion thereof; moving, after the moving of the supply position from the outside to the edge portion, the supply position from the edge portion to the outside while continuously rotating the wafer at the first rotation speed; and rotating, after the moving of the supply position from the edge portion to the outside, the wafer at a rotation speed higher than the first rotation speed to diffuse the resist liquid toward the edge.