AUTOMATIC IN-LINE INSPECTION SYSTEM

A system and method for inline detection of defects on a semiconductor wafer surface during a semiconductor device manufacturing process is disclosed herein. In one embodiment, a method includes: automatically transporting the wafer from a first processing station to an inspection station; scanning...

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Bibliographische Detailangaben
Hauptverfasser:	HSUEH, Ya Hsun, KUO, Shou-Wen, LIU, Hsu-Shui, PAI, Jiun-Rong, LIAO, Chien-Ko, CHUANG, Sheng-Hsiang
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMAGE DATA PROCESSING OR GENERATION, IN GENERAL PHYSICS PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A system and method for inline detection of defects on a semiconductor wafer surface during a semiconductor device manufacturing process is disclosed herein. In one embodiment, a method includes: automatically transporting the wafer from a first processing station to an inspection station; scanning a wafer surface using a camera in the inspection station; generating at least one image of the wafer surface; analyzing the at least one image to detect defects on the wafer surface based on a set of predetermined criteria; if the wafer is determined to be defective, automatically transporting the wafer from the inspection station to a stocker; and if the wafer is determined to be not defective, automatically transporting the wafer to a second processing station for further processing in accordance with the semiconductor device manufacturing process.