An Electronic Device Package

An Electronic Device Package

An electronic device package includes a semiconductor chip having a contact pad on a main face of the semiconductor chip, a contact element disposed on the contact pad, a dielectric layer disposed on the semiconductor chip and the contact element, and an encapsulant disposed onto the dielectric laye...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Fuergut, Edward, Juerss, Michael, Doepke, Holger, Hohlfeld, Olaf
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic device package includes a semiconductor chip having a contact pad on a main face of the semiconductor chip, a contact element disposed on the contact pad, a dielectric layer disposed on the semiconductor chip and the contact element, and an encapsulant disposed onto the dielectric layer.