STANDOFF SPACERS FOR MANAGING BONDLINE THICKNESS IN MICROELECTRONIC PACKAGES

STANDOFF SPACERS FOR MANAGING BONDLINE THICKNESS IN MICROELECTRONIC PACKAGES

A microelectronic package may be fabricated to include a microelectronic substrate, a plurality of microelectronic devices attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one of the plurality of microelectronic devices and attached to the microel...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Deshmukh, Sachin, Dhavaleswarapu, Hemanth K, Beatty, John J, Thanu, Dinesh P. R
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A microelectronic package may be fabricated to include a microelectronic substrate, a plurality of microelectronic devices attached to the microelectronic substrate, a heat dissipation device in thermal contact with at least one of the plurality of microelectronic devices and attached to the microelectronic substrate, and at least one offset spacer attached between the microelectronic substrate and the heat dissipation device to control the bondline thickness between the heat dissipation device and at least one of the plurality of microelectronic devices.