SUBSTRATE PROCESSING APPARATUS AND STANDBY METHOD FOR EJECTION HEAD

In a substrate processing apparatus, an ejection surface of an ejection head located at a standby position is immersed in an immersion liquid retained in a reservoir during standby of the ejection head. This prevents drying of a plurality of outlets provided in the ejection head and drying of processing liquid flow passages that communicate with the outlets. It is thus possible to suppress or prevent clogging of the fine outlets. When the ejection head resumes processing on a substrate, the immersion liquid in the reservoir is discharged and then a liquid removing part removes the immersion liquid adhering to the ejection surface. Accordingly, it is possible to prevent the immersion liquid remaining on the ejection surface from dropping and adhering to the substrate (so-called "liquid dripping") when, for example, the ejection head is moved to a position above the substrate.