MICRO EVAPORATOR, OSCILLATOR INTEGRATED MICRO EVAPORATOR STRUCTURE AND FREQENCY CORRECTON METHOD THEREOF

The present invention provides a micro evaporator, an oscillator integrated micro evaporator structure and a frequency correction method thereof. The micro evaporator comprises a micro evaporation platform, anchor points, supporting beams and metal electrodes, wherein one surface of the micro evapor...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ZHANG, LEI, LI, XINXIN, YANG, HENG, WANG, XIAOFEI, YOU, WEILONG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION OF NOISE BY SUCH CIRCUITS GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING,BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN ANON-SWITCHING MANNER IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY RESONATORS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present invention provides a micro evaporator, an oscillator integrated micro evaporator structure and a frequency correction method thereof. The micro evaporator comprises a micro evaporation platform, anchor points, supporting beams and metal electrodes, wherein one surface of the micro evaporation platform is an evaporation surface; the anchor points are located on two sides of the micro evaporation platform and have a certain distance to the micro evaporation platform; the supporting beams are located between the micro evaporation platform and the anchor points, one end of each supporting beam is connected with the micro evaporation platform and the other end is connected with the anchor point; the size of each supporting beam satisfies the following relation: T=P(L/2kbh)+Ta; and the metal electrodes are located on first surfaces of the anchor points.