ANGLED DIE SEMICONDUCTOR DEVICE

A semiconductor device is disclosed mounted at an angle on a signal carrier medium such as a printed circuit board. The semiconductor device includes a stack of semiconductor die stacked in a stepped offset configuration. The die stack may then be encapsulated in a block of molding compound. The molding compound may then be singulated with slanted cuts along two opposed edges. The slanted edge may then be drilled to expose the electrical contacts on each of the semiconductor die. The slanted edge may then be positioned against a printed circuit board having solder or other conductive bumps so that the conductive bumps engage the semiconductor die electrical contacts in the drilled holes. The device may then be heated to reflow and connect the electrical contacts to the conductive bumps.