Systems And Methods For Assessing The Quality Of Adhesive Bonds

In one embodiment, assessing the quality of an adhesive bond of a composite material includes passing a vector electric field through a thickness of the composite material, measuring dielectric properties of the composite material, determining one or more dielectric parameters of the composite mater...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Raihan, Md Rassel, Reifsnider, Kenneth L, Vadlamudi, Vamsee, Dave, Chaitanya, Elenchezhian, Muthu Ram Prabhu, Banerjee, Priyanshu Kumar
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Raihan, Md Rassel
Reifsnider, Kenneth L
Vadlamudi, Vamsee
Dave, Chaitanya
Elenchezhian, Muthu Ram Prabhu
Banerjee, Priyanshu Kumar
description In one embodiment, assessing the quality of an adhesive bond of a composite material includes passing a vector electric field through a thickness of the composite material, measuring dielectric properties of the composite material, determining one or more dielectric parameters of the composite material, and comparing the one or more dielectric parameters with one or more reference dielectric parameters.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2018340900A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2018340900A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2018340900A13</originalsourceid><addsrcrecordid>eNrjZLAPriwuSc0tVnDMS1HwTS3JyE8pVnDLL1JwLC5OLS7OzEtXCMlIVQgsTczJLKlU8E9TcEzJSC3OLEtVcMrPSynmYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBoYWxiYGlgYGjobGxKkCANV4MMQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Systems And Methods For Assessing The Quality Of Adhesive Bonds</title><source>esp@cenet</source><creator>Raihan, Md Rassel ; Reifsnider, Kenneth L ; Vadlamudi, Vamsee ; Dave, Chaitanya ; Elenchezhian, Muthu Ram Prabhu ; Banerjee, Priyanshu Kumar</creator><creatorcontrib>Raihan, Md Rassel ; Reifsnider, Kenneth L ; Vadlamudi, Vamsee ; Dave, Chaitanya ; Elenchezhian, Muthu Ram Prabhu ; Banerjee, Priyanshu Kumar</creatorcontrib><description>In one embodiment, assessing the quality of an adhesive bond of a composite material includes passing a vector electric field through a thickness of the composite material, measuring dielectric properties of the composite material, determining one or more dielectric parameters of the composite material, and comparing the one or more dielectric parameters with one or more reference dielectric parameters.</description><language>eng</language><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; PHYSICS ; TESTING</subject><creationdate>2018</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20181129&amp;DB=EPODOC&amp;CC=US&amp;NR=2018340900A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20181129&amp;DB=EPODOC&amp;CC=US&amp;NR=2018340900A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Raihan, Md Rassel</creatorcontrib><creatorcontrib>Reifsnider, Kenneth L</creatorcontrib><creatorcontrib>Vadlamudi, Vamsee</creatorcontrib><creatorcontrib>Dave, Chaitanya</creatorcontrib><creatorcontrib>Elenchezhian, Muthu Ram Prabhu</creatorcontrib><creatorcontrib>Banerjee, Priyanshu Kumar</creatorcontrib><title>Systems And Methods For Assessing The Quality Of Adhesive Bonds</title><description>In one embodiment, assessing the quality of an adhesive bond of a composite material includes passing a vector electric field through a thickness of the composite material, measuring dielectric properties of the composite material, determining one or more dielectric parameters of the composite material, and comparing the one or more dielectric parameters with one or more reference dielectric parameters.</description><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASURING</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2018</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAPriwuSc0tVnDMS1HwTS3JyE8pVnDLL1JwLC5OLS7OzEtXCMlIVQgsTczJLKlU8E9TcEzJSC3OLEtVcMrPSynmYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBoYWxiYGlgYGjobGxKkCANV4MMQ</recordid><startdate>20181129</startdate><enddate>20181129</enddate><creator>Raihan, Md Rassel</creator><creator>Reifsnider, Kenneth L</creator><creator>Vadlamudi, Vamsee</creator><creator>Dave, Chaitanya</creator><creator>Elenchezhian, Muthu Ram Prabhu</creator><creator>Banerjee, Priyanshu Kumar</creator><scope>EVB</scope></search><sort><creationdate>20181129</creationdate><title>Systems And Methods For Assessing The Quality Of Adhesive Bonds</title><author>Raihan, Md Rassel ; Reifsnider, Kenneth L ; Vadlamudi, Vamsee ; Dave, Chaitanya ; Elenchezhian, Muthu Ram Prabhu ; Banerjee, Priyanshu Kumar</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2018340900A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2018</creationdate><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASURING</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>Raihan, Md Rassel</creatorcontrib><creatorcontrib>Reifsnider, Kenneth L</creatorcontrib><creatorcontrib>Vadlamudi, Vamsee</creatorcontrib><creatorcontrib>Dave, Chaitanya</creatorcontrib><creatorcontrib>Elenchezhian, Muthu Ram Prabhu</creatorcontrib><creatorcontrib>Banerjee, Priyanshu Kumar</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Raihan, Md Rassel</au><au>Reifsnider, Kenneth L</au><au>Vadlamudi, Vamsee</au><au>Dave, Chaitanya</au><au>Elenchezhian, Muthu Ram Prabhu</au><au>Banerjee, Priyanshu Kumar</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Systems And Methods For Assessing The Quality Of Adhesive Bonds</title><date>2018-11-29</date><risdate>2018</risdate><abstract>In one embodiment, assessing the quality of an adhesive bond of a composite material includes passing a vector electric field through a thickness of the composite material, measuring dielectric properties of the composite material, determining one or more dielectric parameters of the composite material, and comparing the one or more dielectric parameters with one or more reference dielectric parameters.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_US2018340900A1
source esp@cenet
subjects INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
PHYSICS
TESTING
title Systems And Methods For Assessing The Quality Of Adhesive Bonds
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-16T21%3A50%3A22IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Raihan,%20Md%20Rassel&rft.date=2018-11-29&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2018340900A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true